• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    In a protection element having a heating element and a low melting point metal body on a substrate, and the low melting point metal body is melted by the heat generation of the heating element, the protection element is miniaturized without reducing the rated current and the operation time is shortened. In the protection element which has the heat generating body 3 and the low melting-point metal body 5 on the board | substrate 2, and the low melting point metal body 5 is melted by the heat_generation | fever of the heat generating body 3, the heat generating body 3 and the low melting-point metal The sieve 5 is laminated | stacked without passing through an insulating layer.
    公开号:KR20010006916A
    申请号:KR1020000016392
    申请日:2000-03-30
    公开日:2001-01-26
    发明作者:후루우찌유지
    申请人:구리다 히데유키；소니 케미카루 가부시키가이샤；
    IPC主号:
    专利说明:

    Protection device {PROTECTIVE DEVICE}
    The present invention relates to a protection device in which the heating element generates heat by causing the heating element to be energized in the event of abnormality, thereby melting the low melting point metal body.
    Background Art Conventionally, current fuses in which low-melting metal bodies such as zinc, tin, and antimony are melted by overcurrent are widely known as protection devices for blocking overcurrent. Moreover, as a protection element which can be used not only for overcurrent but also for overvoltage, the protection element which consists of a heat generating body and a low melting-point metal body is known (patent 2790433, Unexamined-Japanese-Patent No. 8-161990, etc.).
    FIG. 9 is a circuit diagram of an overvoltage protection device using such a protective element 1p, and FIG. 10 is a plan view (FIG. 10A) and a sectional view (FIG. 10B) of the protective element 1p. This protective element 1p has a structure in which a heating element 3, an insulating layer 4, and a low melting point metal body 5 made of a fuse material are sequentially stacked on a substrate 2 by application of a resist paste or the like. Have In the figure, 6a and 6b are electrodes for a heat generating body, and 7a and 7b are electrodes for a low melting point metal body. In addition, 8 is a solid flux etc., It is an inner side sealing part which seals the low melting-point metal body 5 in order to prevent surface oxidation of the low melting-point metal body 5, 9 is the low melting-point metal body 5 The outer seal is made of a material having a higher melting point or higher softening point and prevents the melt from flowing out of the element during the melting of the low melting point metal body 5.
    In the overvoltage protection device of FIG. 9 using the protective element 1p, the terminals A1 and A2 are connected to electrode terminals of a protected device such as a lithium ion battery, and to the terminals B1 and B2. The electrode terminals of devices such as chargers used in connection with the device to be protected are connected. According to the overvoltage preventing device, if a reverse voltage of more than the breakdown voltage is applied to the zener diode D while the lithium ion battery is being charged, the base current ib rapidly flows, whereby a large collector current ic is generated. 3) The heating element 3 generates heat. This heat is transferred to the low melting point metal body 5 on the heating element 3, the low melting point metal body 5 is melted, and the overvoltage is prevented from being applied to the terminals A1 and A2.
    However, in the overvoltage prevention device of FIG. 9, the energization continues to the heating element 3 even after the low melting point metal body 5 is melted due to the overvoltage. In this regard, an overvoltage prevention device having the circuit of Fig. 11 is known. Fig. 12 is a plan view (Fig. 12A) and a sectional view (Fig. 12B) of the protection element 1q used in the overvoltage preventing device. In this protective element 1q, two heating elements 3 are connected via the intermediate electrode 6c, and a low melting point metal body 5 is formed thereon through the insulating layer 4 thereon.
    According to the overvoltage prevention device of FIG. 11, since the low melting point metal body 5 is melted in two places of 5a and 5b due to the heat generation of the heat generator 3, the energization is completely blocked by the heat generator 3 after they are melted.
    Moreover, as shown in FIG. 13, the heat generating body 3 and the low melting metal body 5 on the board | substrate 2 are not laminated | stacked through the insulating layer 4 through the heat generating body 3 and the low melting metal body 5. As shown in FIG. Is also known. In the figure, 6d, 6e, 6f, and 6g are electrodes, respectively, and 8 is an inner sealing part which consists of a coating film of a flux (Unexamined-Japanese-Patent No. 10-116549, 10-116550).
    However, like the protective elements 1p and 1q shown in Figs. 10 and 12, when the heat generating element 3 and the low melting point metal body 5 are laminated through the insulating layer 4, the heat generating element 3 generates heat. Since the temperature rise of the low melting point metal body 5 is delayed by the heat transfer delay of the insulating layer 4, the operation time (that is, the time until the low melting point metal body 5 is melted after the heating element 3 is energized). It becomes difficult to shorten). Moreover, when a glass component is used for the insulating layer 4, the insulating layer 4 will flow at the time of heat_generation | fever, and there exists a possibility that a bad influence may be exerted on the melting characteristic.
    On the other hand, in the structure in which the heating element 3 and the low melting point metal body 5 are planarly arranged on the substrate 2 as in the protection element 1r of FIG. 13, the heating element 3 or the low melting point metal body 5 Since planar spaces for arranging) are separately required, the planar shape of the element cannot be miniaturized. Therefore, the said protection element 1r is enlarged compared with the above-mentioned protection elements 1p and 1q which laminated | stacked the heat generating body 3 and the low melting-point metal body 5 through the insulating layer 4.
    In this case, if the protection element 1r is simply miniaturized, the electrode area is small, so that the rated current is low or the amount of heat is insufficient, so that the low melting point metal body 5 is not melted.
    Further, in the protection element 1r, since the heat conduction from the heat generating element 3 during heat generation is made through the electrode 6g and the substrate 2, the temperature rise of the low-melting-point metal body 5 is delayed and the operation time is increased. Late. When the thermal conductivity of the board | substrate 2 is made high in order to eliminate the delay of an operation time, when the said protection element 1r is mounted with solder on a base circuit board, the solder for mounting before melting of the low melting-point metal body 5 is carried out. This melts, causing a problem that the protective element 1r is dropped from the base circuit board. In addition, when the melting point of the low melting point metal body 5 is lowered in order to eliminate the delay of the operation time, the reflowing property at the time of mounting the protection element 1r is insufficient, and thus the protection element 1r is damaged. It becomes the parts attached by the
    The present invention is to solve the problems of the prior art as described above, in the protection device for melting the low-melting-point metal body by energizing the heating element, it is possible to miniaturize the device without lowering the rated current, and also to increase the operating time It aims to shorten.
    1 is a plan view (FIG. 1A), a sectional view (FIG. 1B), and a cross sectional view (FIG. 1C) during melting of a low melting point metal body of the protection device of the present invention. FIG.
    2 is a plan view (FIG. 2A) and a sectional view (FIG. 2B) of the protection element of the present invention.
    3 is a plan view (FIG. 3A) and a cross-sectional view (FIG. 3B) of the protection element of the present invention.
    4 is a cross-sectional view of the protection device of the present invention.
    5 is a cross-sectional view of the protective device of the present invention.
    6 is a cross-sectional view of the protective device of the present invention.
    7 is a plan view of the protection element of the present invention.
    8 is a plan view (FIG. 8A), a cross-sectional view (FIG. 8B), and a cross-sectional view (FIG. 8C) during the melting of the low melting point metal body of the protection device of the present invention. FIG.
    9 is a circuit diagram of an overvoltage prevention device.
    10 is a plan view (Fig. 10A) and a cross-sectional view (Fig. 10B) of a conventional protection element.
    11 is a circuit diagram of an overvoltage prevention device.
    12 is a plan view (FIG. 12A) and a cross-sectional view (FIG. 12B) of a conventional protection element.
    13 is a plan view of a conventional protection element.
    Explanation of symbols on the main parts of the drawings
    1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H: protection device
    2: substrate 3: heating element
    4 Insulation layer 5 Low melting point metal body
    6a, 6b: electrode for heating element 6c: intermediate electrode
    6d, 6e, 6f, 6g: electrode 7a, 7b: electrode for low melting point metal body
    8 inner seal 9 outer seal
    10: metal layer to improve the wettability during the heat melting of the low melting point metal body
    11: positive conductor layer
    MEANS TO SOLVE THE PROBLEM In the protection element which has a heat generating body and a low melting metal body on a board | substrate, and a low melting metal body melts by the heat generation of a heat generating body, in order to produce the melting, the low melting metal body wets widely at the time of melting, and reaches the melting space. It is important to ensure that the metal is sufficiently secured, and that the low melting point metal body can be easily melted by improving the wettability with respect to the low melting point metal body at the time of melting, such as a heating element or an electrode which the low melting point metal body is in contact with. In this case, as a heating part by the heating element, what is necessary is just to heat the wet part or its vicinity with the low melting metal body at the time of the melting of the low melting metal body, Therefore, the protective elements 1p and 1q of FIG. As described above, the low melting point metal body is laminated on the heating element through the insulating layer and the heating element is not necessarily generated. A has been completed.
    That is, the present invention has a heating element and a low melting point metal body on a substrate, wherein the low melting point metal body is melted by heat generation of the heating element, wherein the heating element and the low melting point metal body are laminated without passing through an insulating layer. Provide a protection device.
    According to the protection element of the present invention, since the heat generating element and the low melting point metal body are laminated without passing through the insulating layer, the low melting point metal body is quickly heated up when the heat generating element is heated, thereby reducing the operation time. In addition, as in the prior art, the insulating layer may adversely affect the melting characteristics of the low melting point metal body.
    In addition, since the area and volume of the low melting point metal body occupied by the protection element can be increased as compared with the conventional protection element, the protection element can be miniaturized without lowering the rated current of the protection element.
    Embodiment of the invention
    EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated in detail, referring drawings. In addition, in each figure, the same code | symbol shows the same or equivalent component.
    FIG. 1 is a plan view (FIG. 9A), a sectional view (FIG. 9B) and a low melting point metal body of the protection element 1A of the present invention which can realize the same circuit as the protection element 1p in the overcurrent protection device of FIG. Is a cross-sectional view (FIG. 9C).
    The protective element 1A has a low melting point metal body electrode 7a and a heating element 3 on the substrate 2, and a low melting point metal body directly on the low melting point metal body electrode 7a and the heating element 3. (5) is formed. Although not shown, on the low-melting metal body 5, an inner seal made of solid flux or the like is provided on the low-melting metal body 5, and on the outside thereof, the melt flows out of the element when the low-melting metal body 5 is melted. An outer seal or a cap can be provided to prevent it from becoming.
    There is no restriction | limiting in particular as the board | substrate 2, A plastic film, a glass epoxy substrate, a ceramic substrate, a metal substrate, etc. can be used, It is preferable to use an inorganic substrate.
    The heat generating body 3 can be formed by apply | coating the resistance paste which consists of electrically conductive materials, such as ruthenium oxide and carbon black, and inorganic binders, such as water glass, or organic binders, such as thermosetting resins, and bakes as needed. In addition, as the heat generating element 3, thin films, such as ruthenium oxide and carbon black, may be formed by printing, plating, vapor deposition, and sputter | spatter, and may be formed by pasting, laminating | stacking, etc. of these films.
    The low melting point metal body 5 preferably has a large area so that the low melting point metal body 5 is hot melted when the heating element 3 is heated to sufficiently wet the heating element 3 or the low melting point metal body electrode 7a and melt quickly. In addition, the rated current can be increased according to the area.
    As the material for forming the low melting point metal body 5, various low melting point metal bodies used as fuse materials can be used, for example, the alloys described in Table 1 of paragraph [0019] of Japanese Patent Application Laid-Open No. 8-161990. Can be used.
    As the low-melting-point metal body electrode 7a, an electrode on which a metal member such as copper or the surface is plated with Ag-Pt, Au, or the like can be used. In order to produce the melt of the low melting point metal body 5 more quickly when the heat generating element 3 generates heat, the low melting point metal body 5 is formed on the surface of at least the low melting point metal body 5 side of the low melting point metal body electrode 7a. It is preferable to use a metal having high wettability during thermal melting. Examples of such metals include Ag-Pt, Au, Ag-Pd, and the like.
    When the overcurrent protection device of FIG. 9 is configured using the protection element 1A, the heat generator (when a large collector current ic flows to the heat generator 3, similarly to the case of using the conventional protection element 1p of FIG. 3) generates heat, which is directly transferred to the low melting point metal body 5 on the heating element 3 without passing through the insulating layer, so that the low melting point metal body 5 can be rapidly melted as shown in FIG. 1C. Will be.
    FIG. 2 is a plan view (FIG. 2A) and a sectional view (FIG. 2B) of the protection element 1B which can be used for the overvoltage protection device of FIG. 9 similarly to the protection element 1A of FIG. In the protective device 1B, a first low melting point metal body electrode 7a is formed to cover a portion of the heating element 3 on the substrate 2, and the first low melting point metal body electrode 7a and the substrate 2 are formed. The low melting point metal body 5 is formed so that the 2nd low melting point metal body electrode 7b formed separately on () may be extended. In the protective element 1B, both of the low melting point metal body electrodes 7a and 7b located at both ends of the low melting point metal body 5 are made of a metal having good wettability during the heat melting of the low melting point metal body 5. With this arrangement, the low melting point metal body 5 can be melted more quickly when the heat generator 3 generates heat.
    Fig. 3 is a plan view (Fig. 3A) and a cross-sectional view (Fig. 3B) of the protection element 1C of the present invention, which can realize the same circuit as the protection element 1q in the overvoltage protection device of Fig. 11.
    In the protective element 1C, the electrodes 7a and 7b for low melting point metal bodies are formed at both ends of the low melting point metal body 5, and these electrodes 7a and 7b are interposed between these electrodes 7a and 7b. The heating element 3 is formed in the position which is not in contact with). Therefore, at the time of heat generation of the heating element 3, the low melting point metal body 5 is melted in two places between the heating element 3 and the electrode 7a and between the heating element 3 and the electrode 7b.
    In the protection element 1C of FIG. 3, the protection element 1D of FIG. 4 is used for low melting time on the heat generation element 3 so that the low melting point metal body 5 quickly melts when the heat generation element 3 is heated. The melting point metal body 5 and the wettability metal body 10 are formed, and the low melting metal body 5 is laminated | stacked on it. As such a metal, Ag-Pt, Au, Ag-Pd, etc. are mentioned like the constituent material of the low melting metal electrode 7a of the protection element 1A of FIG. 1 mentioned above.
    The protective element 1E of FIG. 5 has an electric conductivity higher than that of the heating element 3 in the protective element 1C of FIG. 3 such that the low melting point metal body on the heating element 3 is uniformly heated when the heating element 3 generates heat. (Iii) The conductive layer 11a is formed on the heating element 3, and the protective element 1F of FIG. 6 transfers the first to the upper surface of the heating element 3 so that the low melting point metal body 5 is heated more uniformly. While forming the whole layer 11a, the 2nd good conductor layer 11b is also formed in the lower surface of the heat generating body 3. As shown in FIG. Such good conductor layers 11a and 11b can be formed of Ag-Pt, Ag-Pd, Au, or the like.
    In the protective element 1G of FIG. 7, the heating element 3 is formed in the shape of a comb so that the low melting point metal body 5 on the heating element 3 is uniformly heated.
    8 is a plan view (FIG. 8A), a sectional view (FIG. 8B), and a low melting point metal body in a molten state (FIG. 8C) of another protective element 1H of the present invention. In the protective element 1H, the upper and lower conductive layers 11a and 11b of the heating element 3 are formed on the upper and lower surfaces of the heating element 3 as in the protective element 1F of FIG. 6. In order to prevent the short-circuit), the conductive layer 11b on the lower surface of the heating element 3 is covered with the heating element 3, and the intermediate electrode 6c inside the second conductive layer 11b for uniform heating. ) Is derived. It is preferable that the intermediate electrode 6c has its resistance lower than that of the heating element 3 and higher than the conductor layers 11a and 11b. More specifically, it is preferable that the volume resistivity is higher by at least one digit than the electrodes 7a and 7b for the low melting point metal body and the conductor layers 11a and 11b.
    In addition to the aspects shown above, the protection element of the present invention may take several aspects as long as the heating element and the low melting point metal body are laminated on the substrate without passing through the insulating layer.
    Example
    EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated concretely based on an Example.
    Example 1
    The protection element 1H of FIG. 8 was produced as follows. As the substrate 2, an alumina ceramic substrate (thickness 0.5 mm, size 5 mm x 3 mm) was prepared, and first Ag-Pd paste (manufactured by Dupont, 6177T) was formed to form the intermediate electrode 6c ( 10 micrometers in thickness, 0.4 mm x 2.0 mm), and baked at 850 degreeC for 30 minutes. Subsequently, in order to form the good conductor layer 11b, Ag-Pt paste (manufactured by Dupont, 5164N) was printed (thickness 10 µm, size 1.5 mm x 1.8 mm), and baked at 850 ° C for 30 minutes. Subsequently, in order to form the heat generating body 3, the ruthenium-oxide resistive paste (Dupont. Make, DP1900) was printed (50 micrometers in thickness) so that the good conductor layer 11b might be covered, and it baked at 850 degreeC for 30 minutes. The pattern resistance of the obtained heating element 3 was 1 Ω. Then, in order to form the good conductor layer 11a on the heating element 3, an Ag-Pt paste (manufactured by Dupont, 5164N) was printed (thickness 10 µm) and fired at 850 ° C for 30 minutes.
    Then, Ag-Pt paste (manufactured by Dupont, 5164N) was printed on the substrate 2 to form the electrodes 7a and 7b for the low melting point metal body (thickness 10 μm, size 1.0 mm × 3.0 mm), and 850 It baked at 30 degreeC for 30 minutes.
    Subsequently, in order to form the low melting metal body 5, the low melting metal foil (Sn: Sb = 95 :) is spread over the low melting metal electrode 7a, the good conductor layer 11a, and the low melting metal body electrode 7b. 5, liquidus point 240 degreeC) (size 1mm x 4mm) were heat-deposited.
    A liquid crystal polymer cap was mounted on the low-melting-point metal body 5 side to obtain a protective element 1H.
    Comparative Example 1
    The protective element 1q shown in FIG. 12 was produced as follows. An alumina-based ceramic substrate (thickness 0.5 mm, size 5 mm x 3 mm) was prepared as the substrate 2, and the low melting point metal bodies electrodes 7a and 7b, the heating element electrodes 6a, and the intermediate electrode 6c were prepared. In order to form, Ag paste (DuPontsha, QS174) was printed and baked at 870 degreeC for 30 minutes. Subsequently, in order to form a pair of heat generating bodies 3, a ruthenium oxide type resistance paste (DuPontsha, DP1900) was printed and baked at 870 degreeC for 30 minutes. The resistance value of each heating element (3: 10 micrometers in thickness, 0.1 mm x 2.0 mm in size) was 4 ohms. Subsequently, a silica-based insulating paste (manufactured by DuPont Shah, AP5346) was printed on each heating element 3 and baked at 500 ° C. for 30 minutes to form an insulating layer 4. Next, as the low melting point metal body 5, low melting point metal foil (Sn: Sb = 95: 5, liquidus point 240 degreeC) (size 1mm x 4mm) was heat-deposited.
    The liquid crystal polymer cap was mounted on the low-melting-point metal body 5 side to obtain a protective element 1q.
    Example 2
    In the same configuration as in Example 1, the size of the low melting metal foil was downsized to 1 mm x 2 mm while maintaining the rated current value (cross-sectional area of the low melting metal foil) equivalent to that of Example 1, and the size of the whole protection element (substrate 2 ) Size was downsized to 3.5 mm x 2.5 mm.
    Comparative Example 2
    With the same configuration as in Comparative Example 1, the size of the low melting point metal foil was simply downsized to 1 mm × 2 mm and the size of the entire protective element was downsized to 3.5 mm × 2.5 mm.
    evaluation
    A voltage was applied to the heating element 3 of each of Examples and Comparative Examples so as to have a power consumption of 4 W, and the time until the low melting point metal body 5 was melted was measured.
    As a result, the protection device of Comparative Example 1 required 21 seconds for melting, but the protection device of Example 1 was 15 seconds. In addition, since the protection element of Example 2 is smaller in size than the protection element of Example 1, both the heat capacity and the heat dissipation amount are reduced compared to the protection element of Example 1, and the melting time is shortened to 10 seconds. On the other hand, the protection element of Comparative Example 2 is for wetting the low melting point metal body 5 with the heat-melted low melting point metal body 5 on the intermediate electrode 6c or the low melting point metal body electrodes 7a and 7b after the low melting point metal body 5 is melted. Since the area could not be secured, the low-melting-point metal body 5 was not melted even when a voltage was applied for 120 seconds.
    According to the present invention, the heating element and the low melting point metal body are disposed in three dimensions without passing through the insulating layer in the protection element which is energized by the heat generating element to generate the heat generating element and melts the low melting point metal body by the heat generation. Therefore, the operation time can be shortened. In addition, the protection element can be miniaturized without lowering the rated current.
    权利要求:
    Claims (7)
    [1" claim-type="Currently amended] A protective element having a heating element and a low melting point metal body on a substrate, wherein the low melting point metal body is melted by heat generation of the heating element, wherein the heating element and the low melting point metal body are laminated without passing through an insulating layer.
    [2" claim-type="Currently amended] 2. A protective element according to claim 1, wherein electrodes are formed at both ends of the low melting point metal body, and a heating element is provided between the electrodes at positions not in contact with these electrodes.
    [3" claim-type="Currently amended] The protection element according to claim 1 or 2, wherein a metal layer having high wettability of the low melting point metal body at the time of hot melting is formed on the heating element, and the low melting point metal body is laminated on the metal layer.
    [4" claim-type="Currently amended] The protection element according to claim 1 or 2, wherein a first good conductor layer having a higher conductivity than a heating element and a low melting point metal body is formed on the heating element, and a low melting point metal body is laminated on the first good conductor layer.
    [5" claim-type="Currently amended] The protective device according to any one of claims 1 to 4, wherein a second conductive layer having a higher conductivity than a heating element and a low melting point metal body is formed on the substrate, and a heating element is formed on the second conductive layer.
    [6" claim-type="Currently amended] 6. A protective device according to claim 5, wherein the second good conductor layer is covered with a heating element.
    [7" claim-type="Currently amended] The protection element according to claim 6, wherein an intermediate electrode is derived from inside the second conductive layer, and the resistance of the intermediate electrode is lower than that of the heating element and higher than that of the conductive layer.
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    同族专利:
    公开号 | 公开日
    EP1041597B1|2007-02-21|
    DE60033461T2|2007-11-08|
    KR100770192B1|2007-10-25|
    US6344633B1|2002-02-05|
    DE60033461D1|2007-04-05|
    JP2000285778A|2000-10-13|
    EP1041597A3|2002-11-27|
    EP1041597A2|2000-10-04|
    JP3640146B2|2005-04-20|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1999-03-31|Priority to JP99-94385
    1999-03-31|Priority to JP09438599A
    2000-03-30|Application filed by 구리다 히데유키, 소니 케미카루 가부시키가이샤
    2001-01-26|Publication of KR20010006916A
    2007-10-25|Application granted
    2007-10-25|Publication of KR100770192B1
    优先权:
    申请号 | 申请日 | 专利标题
    JP99-94385|1999-03-31|
    JP09438599A|JP3640146B2|1999-03-31|1999-03-31|Protective element|
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